特種耐熱樹脂（邊緣虛化的效果）
高純度耐熱特種樹脂
本產品純度可達99%以上，遠超市場95%的常規純度，具有耐高溫(分解溫度﹥420℃)、絕緣強度高、力學性能良好的特點，是性能優異的耐熱結構材料，和H級、C級及以上電氣絕緣材料的理想樹脂基體。
本產品適用于無機基材基體樹脂印制電路板(即芯片)的制造，可作為雷達、航天、導彈的結構材料以及200級以上電氣絕緣材料的樹脂基體材料。
High purity heat-resistant specialty resin
The purity of this product can reach more than 99%, far exceeding the conventional purity of 95% on the market. This product has the characteristics of high temperature resistance (decomposition temperature > 420 °C), high dielectric strength and good mechanical properties, and is a heat-resistant structural material with excellent performance, and also an ideal resin matrix for H-class, C-class and above electrical insulation materials.
This product is suitable for the manufacture of printed circuit boards (i.e., chips) based on inorganic substrate, can also be used as the structural material of radar, aerospace, missile, and as a resin matrix material of electrical insulation materials above 200℃.
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